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Call For Papers IEEE ARM 2023 (Sanya, China, July 8 to 10, 2023)

2022年12月30日 14:42  点击:

IEEE ARM 2023

The 2023 IEEE International Conference on
Advanced Robotics and Mechatronics

July 8-10, 2023

Sanya, China

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Dear Colleagues,

The IEEE International Conference on Advanced Robotics and Mechatronics (ICARM) is the flagship conference of both IEEE-SMC TC on Bio-mechatronics and Bio-robotics Systems, and IEEE-RAS TC on Neuro- Robotics Systems. IEEE ARM has been awarded as the official A-Class conference by the Chinese Association of Automation. The ICARM 2023 will be organized by Hainan University, China, and held in Sanya, China, from July 8th to 10th, 2023. The conference will provide an international forum for researchers, educators, and engineers in general areas of mechatronics, robotics, automation, and sensors to disseminate their latest research results and exchange views on the future research directions of these fields. Click here to Visit Conference Website.

All papers must be submitted in PDF format prepared strictly following the IEEE PDF Requirements. The standard number of pages is 6 and the maximum page limit is 8 pages with extra payment for the two extra pages. All papers accepted by IEEE ICARM 2023 will be indexed by EI and included in IEEE Xplore.



Deadlines:

Date


Activity Content

January 31, 2023


Full paper and organized session proposals

January 31, 2023


Proposals for tutorials and workshops

April 20, 2023


Notification of paper and session acceptance

May 20, 2023


Submission of final papers in IEEE PDF format





Click here to Submit Papers and Proposals to ARM 2023


In case of any specific needs or questions, please do not hesitate to contact the conference secretariat at: icarm2023@gmail.com

We are looking forward to receiving your contributions and welcoming you in Sanya, China, on July 2023 ! (see the conference website for more tourist information).


General Chair

Weidong Zhang, Hainan Univ. / SJTU, China

Program Chair

Jianqiang Li, Shenzhen Univ., China

Wei He, Univ. of Sci. and Tech. of Beijing, China

Organizing Chair

Chenglong Fu, South Univ. of Sci. and Tech., China

Hang Su, Politecnico di Milano, Italy


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